STATS ChipPAC is one of the leading service providers of semiconductor packaging design, assembly, testing and distribution solutions in the world. It specializes in mixed signal testing and advanced packaging technology for semiconductors used in diverse end market applications, including communications, consumer and computing. The company owns and operates STATS ChipPAC Taiwan Semiconductor Corporation, formerly known as Winstek Semiconductor Corporation. STATS ChipPAC offers a range of assembly solutions to meet IC packaging needs, from standard plastic, small and thin packages to flip chip bonding, system-in-packaging, advanced stacked die, and multichip and multipackage assembly. It additionally provides wafer bumping and redistribution services.