PacTech USA is a leading provider of advanced packaging technologies and services, specializing in processes such as laser soldering, electroless plating, and wafer level component assembly. With a wide range of applications across sectors including aerospace, automotive, and consumer electronics, PacTech offers innovative solutions for intermetallic connections, solder bump formation, and die attachment.
With locations in Santa Clara, CA, as well as Germany and Malaysia, PacTech is committed to delivering high-quality products and services to its global customer base. Their expertise in electroplating, redistribution layering, and wafer dicing makes them a trusted partner in the production and assembly of cutting-edge electronic devices.
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