Founded in 2000, Avicenna Technology, in Montevideo, Minn., is one of the premier providers of laser machining services and laser-based manufacturing solutions. Avicenna's automated wire handling systems can precisely ablate wire as fine as 52-AWG and perform the ablation in either a continuous reel-to-reel process or in a pull and cut process. Avicenna's laser ablation techniques can remove coatings as thick as .005-inches from all manner of substrates. It can laser drill slots, grooves and holes of any shape into many of the specialized polymers used in the medical and electronics industries. The company specializes in laser marking materials that have traditionally been difficult to mark with conventional printing and embossing methods. Avicenna's laser skiving process is a controlled-depth laser ablation process applied to tubing and other cylindrical objects. It also provides parylene coatings on geometrically complex substrates. Avicenna also provides tube cutting facilities, with the capability to precisely cut polymer-based tubing to any length.